ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,751,307, issued on Sept. 29, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Semiconductor package" was invent... Read More
ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,751,308, issued on Sept. 29, was assigned to ND-HI TECHNOLOGIES LAB INC. and ETRON TECHNOLOGY INC. (Hsinchu, Taiwan). "Semiconductor package a... Read More
ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,751,309, issued on Sept. 29, was assigned to Intel Corp. (Santa Clara, Calif.). "Integrated circuit packages with silver and silicon nitride m... Read More
ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,751,310, issued on Sept. 29, was assigned to FURUKAWA ELECTRIC Co. LTD. (Tokyo). "Dicing die attach film and method of producing the same, and... Read More
ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,751,311, issued on Sept. 29, was assigned to THE UNIVERSITY OF HONG KONG (Hong Kong). "Cu-Cu direct welding for packaging application in semic... Read More
ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,751,312, issued on Sept. 29, was assigned to Intel Corp. (Santa Clara, Calif.). "Nano-roughened interconnects for integrated circuit packages"... Read More
ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,751,313, issued on Sept. 29, was assigned to Adeia Semiconductor Bonding Technologies Inc. (San Jose, Calif.). "Selective alteration of interc... Read More
ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,751,314, issued on Sept. 29, was assigned to WINBOND ELECTRONICS CORP. (Taichung City, Taiwan). "Die package structure and method for forming ... Read More
ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,751,315, issued on Sept. 29, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package and method of manufa... Read More
ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,751,316, issued on Sept. 29, was assigned to VisEra Technologies Co. Ltd. (Hsin-Chu City, Taiwan). "Microelectronic device" was invented by We... Read More